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studied experimentally nanolayered laminated composites of Al and SiC and found that such composites exhibit much higher modulus and hardness than the pure Al layer.Ī simpler scenario is the cutting of polycrystals. While most studies focus on single-phase and single-crystalline materials, simulations of composite materials are more rare. Several studies found that, in the nanoscale, these materials behave in a ductile way this phenomenon was termed the “brittle-ductile transition” since seemingly brittle materials change their behavior and show ductile features. For ceramics, SiC was studied intensely but also, elemental Si was investigated repeatedly as a prototypical example of a brittle material, even if it is not a ceramic in the strict sense of the word. Thus, for crystalline metals, several studies showed that dislocation formation, reactions, and migration constitute the dominant deformation processes here, both elemental metals of fcc, bcc, and hcp structure as well as alloys, compounds, and bulk metallic glasses have been examined. Such nanocutting processes can well be studied by the method of MD simulation, and this approach has provided relevant results both for metals and for ceramics. In so-called “ultra-high precision machining” processes, the controlled removal of surface layers in the range of tens of nanomilliliters or even nanomilliliters is attempted.
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Molecular dynamics (MD) simulations of nanocutting of solids received much attention in recent years. The crystallinity of the Si chip is strongly changed if an Al substrate is put under the Si top layer: With decreasing thickness of the Si top layer, the Si chip retains a higher degree of crystallinity. Covering an Al substrate with a thin Si top layer has the detrimental effect that the hard Si requires high pressures for cutting as a consequence, twinning planes with intersecting directions are generated that ultimately lead to cracks in the ductile Al substrate. When putting an Al top layer on a Si substrate, the thrust force is reduced the opposite effect is observed if a Si top layer is put on an Al substrate. Cutting of Si crystals requires thrust forces that are larger than the cutting forces in order to induce amorphization in metals, the thrust forces are relatively smaller than the cutting forces. We find that twinning adds as a major deformation mechanism in the cutting of Al crystals. While the plasticity of metals is dominated by dislocation activity, the deformation behavior of Si crystals is governed by phase transformations-here to the amorphous phase. Using the molecular dynamics simulation, we study the cutting of Al/Si bilayer systems.
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